X-Ray is the proven industry standard process for identifying any structural defects in solder joints. We utilize our X-Ray system to examine high density joints on fine pitch components and hidden joints on any devices such as BGAs (Ball Grid Array). We also inspect for structural defects in solder ball joints which if not captured can lead to voiding that can result in long-term field failure. Investing in X-Ray technology means STIM Canada is well positioned to cope with technologies now and in the future.
Defect categories that can be identified through X-Ray:

  • Insufficient
  • Excess
  • Shorts
  • Marginal Joints
  • Voids
  • Bridging