Many of our customers require complete BOX BUILD ASSEMBLY solution. Often, this includes Cable Assemblies and Wire Harness Assemblies, conformal coating, ruggedization and multitudes of different type of tests and verifications. We utilize our strategic off-shore and on-shore supply chain partners to procure any type of enclosure and materials required to build the final product […]

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STIM Canada specializes in manufacturing PCBAs using fully automated state -of-the-art surface-mount technology (SMT) and pin through-hole (PTH) equipment. Our technologically advanced facilities offer high-speed surface-mount capabilities providing performance and reliability at placement rates of up to 120,000 CPH. We can populate both single and double-sided SMT, PTH, and high-mix designs with speed and accuracy. […]

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We recognize time to market is a vital key to any entrance strategy, and as a result STIM Canada leads the way with an unrivalled Prototyping/NPI process. STIM’s dedicated quick-turn prototyping division enables our customers take advantage of our on-site rapid prototyping (2-5 days) services to verify functionality and manufacturability. Early visibility of the prototype […]

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STIM Canada has a strong partnership with third party Flying Probe OEMs. The flying probe system offers maximum flexibility in electrical testing for low to medium volume production. Flying probe testing has the added advantage of being able to test PCB assemblies with limited test access. Flying probe test uses fixtureless technology which minimizes set-up […]

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An Automated Optical Inspection (AOI) system delivers reliable and repeatable results ensuring that our manufactured products proceed to the next stage defect free. Those assemblies that cannot be inspected under AOI are manually inspected by one of our experienced team of trained Inspectors. Defect categories that can be identified through AOI process: Part Polarity Vendor […]

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For those customers who have higher volume requirements we have Teradyne In-Circuit (ICT) bed of nails test systems. Teradyne ICT systems offer the most comprehensive, reliable and repeatable electrical test through bed-of-nails technology. Our Test Engineering team at STIM Canada can provide turnkey ICT test solutions through partnering with our preferred fixture house.

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X-Ray is the proven industry standard process for identifying any structural defects in solder joints. We utilize our X-Ray system to examine high density joints on fine pitch components and hidden joints on any devices such as BGAs (Ball Grid Array). We also inspect for structural defects in solder ball joints which if not captured […]

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>We have compre­hensive expe­rience in deve­lo­ping test so­luti­ons on many platforms including Labview, C++, IEEE, Assembly language and Arduino. We work closely with our customers to utilize consigned test kits, develop testing solutions from scratch, improve and de-skill existing solutions to reduce test times. We use JTAG Technologies platform to execute Boundary Scan test routines […]

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STIM Canada offers comprehensive BGA and other delicate package rework services. We use highly specialized rework systems to replace defective parts in the unlikely event of a device failure. We perform specialized rework while retaining the value of the components that are already soldered to the board. The task of de-soldering, placement and re-soldering of […]

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PCBAs and harness/mechanical assemblies that cannot be inspected using our AOI systems are examined by our professionally IPC trained team of Manual Inspectors. Working to IPC-610 Class 2 and 3 and using their skills and experience gained over many years, we aim to minimize the opportunity for error and maximize inspection coverage.

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